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French gendarmerie researchers show voltage glitching bypasses eMMC password locks on 3 of 10 commercial parts, with measurable evidence alteration

A paper from France's Institut de Recherche Criminelle quantifies both the success rate and the data-integrity cost of fault-assisted eMMC access in forensic investigations.

10 Sept 2026Generated imageDesign & EDA

NVIDIA details Vera CPU's Olympus core architecture at Hot Chips 2026, claiming 1.8x agentic AI speedup

NVIDIA presented the full microarchitecture of its 88-core Vera CPU at Hot Chips 2026 on 24 August, claiming up to 1.8x faster task completion on agentic workloads versus x86 competitors.

9 Sept 2026Generated imageDesign & EDA

Chips&Media's WAVE6331X FuSa video codec IP earns ISO 26262 ASIL-B certification from DNV

Chips&Media received ISO 26262 ASIL-B certification for its WAVE6331X FuSa video codec IP on 2 September 2026, covering H.264, H.265, AV1, and VP9 for automotive SoC integration.

9 Sept 2026Generated imageDesign & EDA

AI is compressing the design cycle - and exposing physical realization as the next bottleneck

As agentic AI shrinks the path to tape-out, the constraint in semiconductor development is migrating downstream - into packaging, multi-physics signoff, and physical realization.

8 Sept 2026Generated imageDesign & EDA

Synopsys hosts TetraMem and ANAFLASH at DAC 2026 to show compute-in-memory chips attacking the AI weight-movement bottleneck

At DAC 2026 on 28 July, Synopsys hosted TetraMem and ANAFLASH to show how non-volatile compute-in-memory chips sidestep the data-movement cost that limits AI at the edge.

8 Sept 2026Generated imageDesign & EDA

SEMI sets SEMICON West 2026 program around the industry's $1 trillion revenue milestone

SEMI announced the full SEMICON West 2026 program on 27 August, placing the industry's $1 trillion revenue milestone and AI-driven chip design at the center of three days in San Francisco.

7 Sept 2026Generated imageDesign & EDA

Delmic co-founder Sander den Hoedt built a TU Delft spinoff into a three-product electron microscopy company over 15 years

SemiWiki's CEO interview with Sander den Hoedt traces how a 2010 TU Delft patent became Delmic's SECOM, FAST-EM, and METEOR product lines for nanoscale imaging.

7 Sept 2026Generated imageDesign & EDA

Signaloid founder Phillip Stanley-Marbell steps down from Cambridge chair to run probabilistic computing startup full-time

SemiWiki's CEO interview with Phillip Stanley-Marbell traces his path from Bell Labs and Apple to founding Signaloid, a Cambridge spinout whose C0-ASIC targets 1000× performance-per-watt gains.

22 Aug 2026
Design & EDA
Design & EDA

TSMC's COUPE co-packaged optics platform enters production in the second half of 2026

TSMC's Compact Universal Photonic Engine moves from qualification to volume production in H2 2026, promising 2x power efficiency and 10x lower latency over pluggable optics.

22 Aug 2026Generated imageDesign & EDA

Agentrys claims its Studio platform lets chip design teams assemble a custom multi-agent flow in 30 minutes

Agentrys says its Studio platform can stand up a custom multi-agent chip design flow in about 30 minutes, with a live demonstration planned for Hot Chips 2026 on 23-25 August.

21 Aug 2026Generated imageDesign & EDA

Siemens EDA details Questa One's three-pillar AI update at DAC 2026

Siemens EDA briefed attendees at DAC 2026 on Questa One's latest AI-driven verification updates, covering faster engines, MCP-enabled inter-engine communication, and an Agentic Toolkit with five domain-scoped agents.

21 Aug 2026Generated imageDesign & EDA

Quadric schedules three conference appearances to demonstrate Chimera GPNPU between 23 August and 24 September 2026

Quadric will appear at HotChips, AI Infra Summit, and Embedded World North America between 23 August and 24 September 2026 to demonstrate its Chimera GPNPU processor IP.

20 Aug 2026

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