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Cadence's Tensilica HiFi iQ DSP puts natural language processing directly on edge SoCs

Cadence's sixth-generation Tensilica HiFi iQ DSP delivers 2x compute and 8x AI performance over its predecessor, moving NLP and voice AI fully on-device for edge SoCs.

10 Sept 2026Generated imageSemiconductors

Keysight's forensic team argues hardware-layer testing is now a prerequisite for locked-device investigations

Keysight Device Security Testing published a framework in August 2026 explaining when and how forensic teams must move beyond software acquisition into side-channel analysis and fault injection.

10 Sept 2026Generated imageSemiconductors

SEMI publishes nine-point position paper urging EU to widen Chips Act 2.0 beyond fabs

SEMI has published a nine-recommendation position paper calling on EU co-legislators to extend Chips Act 2.0 incentives across the full semiconductor value chain, from design to advanced packaging.

9 Sept 2026Generated imageSemiconductors

Energy Vault completes land acquisition for its 125 MW / 1 GWh Stoney Creek BESS in New South Wales

Energy Vault has acquired full freehold ownership of the Stoney Creek BESS site in northern NSW, clearing a key development hurdle ahead of a Q1 2027 construction start.

9 Sept 2026Generated imageSemiconductors

Humanoid robot shipments surged nearly 300% in H1 2026, but battery life and compute architecture remain the hard limits

Global humanoid robot shipments exceeded 22,000 units in H1 2026, up nearly 300% year-on-year. The semiconductor industry is now the binding constraint on how fast the ramp can continue.

9 Sept 2026Generated imageSemiconductors

SEMI and Silicon Catalyst sign global MOU to connect semiconductor startups with industry networks

SEMI and Silicon Catalyst signed a global MOU at SEMICON Taiwan 2026 on 2 September, linking the accelerator's 150+ portfolio companies with SEMI's 4,000-member global network.

8 Sept 2026Generated imageSemiconductors

Molex's MiniMix connector puts 15 A and 1 Gbps Ethernet into a 5.65 mm profile for humanoid robot joints

Molex unveiled MiniMix on 5 August 2026, a hybrid power-and-signal connector that routes 15 A and 1000BASE-T1 Ethernet through a 5.65 mm profile for humanoid robot joints.

8 Sept 2026Generated imageSemiconductors

Amphenol extends its H4 solar connector platform to 2000 V DC with the new H4 Plus P2KV

Amphenol Industrial Operations has added a 2000 V DC connector to its H4 Plus family, targeting utility-scale PV and solar-plus-storage systems moving beyond 1500 V architectures.

8 Sept 2026Generated imageSemiconductors

Bürkert extends SideCONTROL positioner range to add digital communications to existing pneumatic valves

Bürkert's SideCONTROL electropneumatic positioners mount on existing pneumatic actuators to add IO-Link, industrial Ethernet, and onboard PID control without replacing installed valves.

7 Sept 2026Generated imageSemiconductors

binder extends its M12 portfolio with an angled PCB connector designed for tubular sensor housings

binder's new angled M12-A connector mounts flush with the PCB plane rather than stacking above it, targeting compact sensors and industrial automation devices built into narrow cylindrical housings.

7 Sept 2026Generated imageSemiconductors

YXY Electronics adds IP68 CAT6 coupler to its M20 connector line for permanent outdoor Ethernet runs

YXY Electronics' YPM20-CAT6CAT6-2 brings IP68 sealing, gold-plated contacts, and a -40 °C to +105 °C operating range to standard RJ45 Gigabit Ethernet field joints.

7 Sept 2026Generated imageSemiconductors

Semiconductor Engineering frames energy efficiency as the defining constraint for AI computing through 2030

Data center electricity is set to nearly double to 945 TWh by 2030, making energy efficiency the central strategic challenge - and opportunity - for every company deploying AI at scale.

22 Aug 2026

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